Electronics Forum | Wed Jan 17 07:28:29 EST 2007 | davef
Look here: http://www.smtinfo.net/Db/_Reflow%20Soldering.html
Electronics Forum | Thu Jun 08 01:52:16 EDT 2006 | ec
Hi, Is there any special temperature setting for example , bottom temp should be lower than top temp to prevent component drop. Or any information that can help to prevent component from drop off during reflow of top side.
Electronics Forum | Thu Jun 08 17:21:31 EDT 2006 | PWH
EC - I hope you don't mind that I add to your question... We are running lead free assemblies now and parts that normally hang on upside down are falling off. Any advice on this from others new to lead free?
Electronics Forum | Fri Jun 09 04:21:20 EDT 2006 | rlackey
Hi EC, there was an in depth post dealing with this back in 2000 from the now legendary Bob Willis: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=1468&#Message6342 Cheers, Rob.
Electronics Forum | Thu Jun 08 03:40:32 EDT 2006 | aj
Hi, I use convection reflow and both top & bottom settings are the same. Is the part too heavy to rely on surface tension? there is an equation that can determine this (aswell as real test i.e. part falling off) We have some SIM Card holders on bot
Electronics Forum | Wed Oct 11 20:52:51 EDT 2006 | psgill
Guys, Any of you tried running different setting on the top & bottom side temperature on the reflow oven. I'm trying to address uBGA coplanarity issue using this method. Assume board are flat. Any inputs?
Electronics Forum | Wed Jun 12 04:02:00 EDT 2019 | liyunqiong
SMT reflow soldering temperature setting and process flow: The influence of SMT reflow process parameters on the key parameters of reflow soldering temperature curve provides reference for the setting and adjustment of reflow soldering process para
Electronics Forum | Thu Aug 11 12:45:42 EDT 2016 | anhsang38
Dear All I have a question for the reflow machine. I'm using Vitronics(Mr933+)reflow. The peak temperature of the (Chip, LED, SOT) component higher than (QFP,LGA) about 4 degree when i measured proflie. All of them on the same board . I don't know w
Electronics Forum | Thu Jun 08 04:31:24 EDT 2006 | vasily
Hi First I think you have to analize your PCB design. Heavy weight components should be gathered on one side of PCB. As I think, if you want to reflow both sides simultaneously there might be a problem. A chance that large components will drop off
Electronics Forum | Thu Oct 12 08:12:51 EDT 2006 | realchunks
I have, but not for what you are trying. Different ovens and styles react differently when you try this, so you have to experiment to see how far you can go. Why do you think different temps top and bottom will solve the coplanairty issue? Is this
